Process solutions

for the semiconductor and microelectronics industry

centrotherm has been developing and implementing innovative thermal solutions for more than 70 years. As a leading and globally operating technology group, we offer production solutions for the semiconductor and microelectronics industries.

The continuous further development of our technology for thermal processing and layer deposition on semiconductor materials is the basis for successful partnerships with industry and science. Our customers worldwide appreciate the process stability, scalability and reliability of our production systems in laboratory or pilot scale as well as in mass production. We develop pioneering process technologies that are specifically tailored to our customers' requirements. In this way, we generate competitive advantages for our customers through dedicated innovative process and production solutions.

Overview WBG semiconductor technologies

From silicon to WBG compound semiconductors

As one of the leading developers and manufacturers of production equipment, we offer solutions for various semiconductor technologies and applications. Our technology portfolio includes equipment for processing various substrates and material classes - from silicon-based semiconductors to wide bandgap WBG semiconductors such as SiC or GaN.

We realize your individual application with advanced process technologies

Our process expertise

Wafer manufacturing

Silicon

  • Annealing
  • Wet / dry oxidation
  • LP Poly

SOI

  • Wet / dry oxidation

SiC

  • HT Annealing

Power semiconductor

MOS

  • Diffusion / Oxidation
  • LPCVD
  • RTP

IGBT

  • HT Oxidation / Drive-in
  • Al/Ga Deposition / Diffusion
  • Thin-wafer annealing
  • Vacuum soldering

GaN HEMT

  • Dielectrics / Passivation
  • RTP

SiC MOSFET

  • Annealing (Activation / Trench smoothing)
  • Oxidation (Gate /POA)
  • RTP

MEMS / TSV

  • Poly Si / SiGe (doped / undoped)
  • Low-stress SiN / SiO
  • Doped / undoped SiO2 (TEOS / LTO / HTO)
  • Vacuum soldering

Optoelectronics

VCSEL

  • LT wet oxidation
  • Vacuum soldering

Laser diodes / Fiber optic communication

  • Vacuum soldering

Advanced Packaging

  • Vacuum soldering
  • Bump reflow
  • Vacuum sealing

Passive components

Copper

  • Direct Copper Bonding (DCB)
  • Active metal brazing

Ceramics

  • Sintering (MLCC / LTCC)

Glass

  • Reflow soldering
  • Glass to substrate bonding

Leading technology for SiC high-temperature processing

Wafers up to 200 mm

With our high-temperature furnaces for annealing and oxidation processes for SiC wafers up to 150 mm we are the global technology leader and supplier to renowned manufacturers of power electronics. Our next generation equipment for 200 mm wafers which is bridging-capable for 150 mm wafers enables our customers to reduce their costs by up to 23%.

Equipment for the semiconductor industry

Horizontal and vertical systems

Horizontal process system for wafers up to 200 mm
c.HORICOO 200

Horizontal process system 300 mm wafers
c.HORICOO 300

Vertical process system for wafers up to 200 mm
c.VERTICOO

High-temperature furnaces for WBG semiconductors

High-temperature annealing system
c.ACTIVATOR

High-temperature oxidation system
c.OXIDATOR

Rapid Thermal Processing equipment

RTP system for wafers up to 200 mm
c.RAPID 200