The centrotherm c.VACUNITE contact heat system platform covers a wide range of thermal vacuum applications. The versions 24, 12 and 6 are designed for process performance-based R&D and pilot scale production. In the field of vacuum soldering the systems meet highest requirements of voidless soldering for Advanced Packaging and Power Semiconductor applications. The void-affected area can be reduced to less than 1% whereas common reflow soldering systems range at 5%.
c.VACUNITE systems ensure fast heat-up and cool-down rates for short cycle times and reach temperatures up to 450 °C.
c.VACUNITE vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% hydrogen (H2), formic acid (HCOOH) or forming gas (N2H2). All systems are suited for 100% paste and flux.
The process control computer is equipped with a user-friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.
Processes
- Power semiconductor applications
- Advanced packaging
- Hybrid microelectronic assemblies
- Optoelectronic packaging
- Hermetic package sealing
- Wafer level packaging
- UHB LED packaging
- MEMS package sealing
- Glass bonding
- Copper annealing
- Thermal processes in various atmospheres
- Inert gas | Annealing | Oxidation
Options
- Pure hydrogen (H2)
- Vacuum system with dry pump
- Customized MES interface
Features & Benefits
- Excellent temperature uniformity ±0.5%
- 100% suitable for paste and flux
- Independent and separately controllable gas lines
- Flux management
- Remote access for service
- Cooling water supply by open water cooling system or domestic water supply
- Safety PLC
- Maintenance friendly design for high uptime
