Process solutions

for the semiconductor and microelectronics industry

centrotherm has been developing and implementing innovative thermal solutions for more than 70 years. As a leading and globally operating technology group, we offer production solutions for the semiconductor and microelectronics industries.

The continuous further development of our technology for thermal processing and layer deposition on semiconductor materials is the basis for successful partnerships with industry and science. Our customers worldwide appreciate the process stability, scalability and reliability of our production systems in laboratory or pilot scale as well as in mass production. We develop pioneering process technologies that are specifically tailored to our customers' requirements. In this way, we generate competitive advantages for our customers through dedicated innovative process and production solutions.

From silicon to WBG compound semiconductors

As one of the leading developers and manufacturers of production equipment, we offer solutions for various semiconductor technologies and applications. Our technology portfolio includes equipment for processing various substrates and material classes - from silicon-based semiconductors to wide bandgap WBG semiconductors such as SiC or GaN.

From silicon to WBG compound semiconductors
We realize your individual application with advanced process technologies

Our process expertise

Wafer manufacturing


  • Annealing
  • Wet / dry oxidation
  • LP Poly


  • Wet / dry oxidation


  • HT Annealing

Power semiconductor


  • Diffusion / Oxidation
  • RTP


  • HT Oxidation / Drive-in
  • Al/Ga Deposition / Diffusion
  • Thin-wafer annealing
  • Vacuum soldering


  • Dielectrics / Passivation
  • RTP


  • Annealing (Activation / Trench smoothing)
  • Oxidation (Gate /POA)
  • RTP


  • Poly Si / SiGe (doped / undoped)
  • Low-stress SiN / SiO
  • Doped / undoped SiO2 (TEOS / LTO / HTO)
  • Vacuum soldering



  • LT wet oxidation
  • Vacuum soldering

Laser diodes / Fiber optic communication

  • Vacuum soldering

Advanced Packaging

  • Vacuum soldering
  • Bump reflow
  • Vacuum sealing

Passive components


  • Direct Copper Bonding (DCB)
  • Active metal brazing


  • Sintering (MLCC / LTCC)


  • Reflow soldering
  • Glass to substrate bonding

Leading technology for SiC high-temperature processing

With our high-temperature furnaces for annealing and oxidation processes for SiC wafers up to 150 mm we are the global technology leader and supplier to renowned manufacturers of power electronics. Our next generation equipment for 200 mm wafers which is bridging-capable for 150 mm wafers enables our customers to reduce their costs by up to 23%.

centrotherm is technology partner of the European REACTION research project to establish the first European 200 mm SiC production line. The project is funded by the EU and the German Federal Ministry of Education and Research (BMBF) as part of the ECSEL (Electronic Components and Systems for European Leadership) research program.

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This is the website of centrotherm international AG, Blaubeuren. If you are looking for the website of Centrotherm Systemtechnik GmbH, Brilon, Germany please click here. Please note that the two companies have no business connection with one another.