Our products
Our product portfolio includes production systems for thermal processes, such as annealing, oxidation, diffusion, LPCVD, PECVD, epitaxy, soldering and packaging. They are successfully employed in the semiconductor industry worldwide, offering high-quality process results, low operating costs and maximum throughput.
Processes
Diffusion, BBr3 doping, B2H6 doping, POCl3 doping, H2 and N2 tempering, wet and dry oxidation (option: DCE, HCl), drying, activation tempering, silicide formation, nitrididation formation, contact sintering, polysilicon, doped polysilicon, silicon-nitride, oxinitride, TEOS, HTO, SIPOS and BTBAS.
Thanks to voidless and fluxless reflow soldering, our vacuum soldering systems offer ultra-clean solder joints for the following applications, among others: Power semiconductors, microelectronic hybrid modules, optoelectronic packaging, wafer level packaging, UHB-LED packaging, MEMS
Product overview
Vertical Batch Wafer Furnaces
Activator 150 high temperature annealing furnace
The centrotherm Activator 150 high temperature furnace line has been developed for post implantation annealing of Silicon Carbide (SiC) or Gallium Nitride (GaN) devices. The Activator 150 is available in various versions as R&D and serial production furnace and offers a high process flexibility. The unique design of the centrotherm metal-free heating allows process temperatures up to 1850 °C and shorter process cycle times. The Activator 150 allows a cost-effective production due to its small footprint and low cost of ownership.
- high activation rate
- minimal surface roughness
- temperatures up to 1850°C
- batch size up to 50 (150mm) wafers
- heating rate up to 150 K/min
- silicon “overpressure” due SiH4
Applications
- Annealing
Horizontal Batch Wafer Furnaces
E 1200 R&D furnace
The E 1200 small batch laboratory system supports the multiple process capability needs of a low volume production with high process performance. The centrotherm design is outstanding for high performance, small footprint and low cost of ownerhip while offering a high process flexibility required for multiple applications.
- processes: atmospheric, PECVD and LPCVD
- process selectable chamber options available in 3 or 4 stack configurations
- advanced water cooling system guarantees no thermal interference between the different process tubes
- optional: automated boat loading
- modular component design for ease of installation and start up
Applications
- Annealing
- Diffusion
- LPCVD
- Oxidation
- PECVD
Horizontal Batch Wafer Furnaces
E 1550 pilot line production furnace
The centrotherm E 1550 horizontal furnace is optimized to support the multiple process capability needs of a small or medium volume production and features high process performance and flexibility. It contains up to 4 stacked quartz or SiC tube process chambers for wafer sizes up to 300 mm. The E 1550 perfectly combines operational and maintenance costs with a small footprint and thus allows the user cost-effective production possibilities.
- processes: atmospheric, PECVD and LPCVD
- process selectable chamber options available in 3 or 4 stack configurations
- advanced water cooling system guarantees no thermal interference between the different process tubes
- optional: automated boat loading
- modular component design for ease of installation and start up
Applications
- Annealing
- Diffusion
- LPCVD
- Oxidation
- PECVD
Horizontal Batch Wafer Furnaces
E 2000 horizontal high volume production furnace
centrotherm E 2000, specially designed for series production, is an exceptional solution on account of its high process performance, maximum throughput, low maintenance costs and small footprint. The furnace offers flexible process capability and contains up to 4 stacked quartz or SiC tube process chambers for wafer sizes up to 300 mm.
- processes: atmospheric, PECVD and LPCVD
- process selectable chamber options available
- advanced water cooling system guarantees no thermal interference between the different process tubes
- optional: automated boat loading
- modular component design for ease of installation and start up in clean room facilities
Applications
- Annealing
- Diffusion
- LPCVD
- Oxidation
- PECVD
Vertical Batch Wafer Furnaces
Oxidator 150 high temperature oxidation furnace
The Oxidator 150 is a high-temperature furnace, especially designed for the oxidation of silicon carbide (SiC) by centrotherm thermal solutions. Its capability to run high process temperatures of up to 1400°C and oxidation processes using O2, N2O, NO, NO2 or WetOx atmosphere makes for an excellent combination of flexibility and proven process quality. Equipped with metal-free heating and double vacuum, the Oxidator 150 is currently the safest ToxGas oxidation furnace on the market.
- batch processing of 2“, 3“, 100 mm und 150 mm wafers or any combination
- maximum heating rate up to 7.5 K/min
- batch size up to 50 (150 mm) wafers
- process pressure range from 850 mbar to atmospheric pressure
Applications
- Oxidation
Vertical Batch Wafer Furnaces
verticoo 200 mass production vertical system
Designed for high volume production with a maximum throughput rate and a high degree of flexibility, the verticoo 200 is suitable for all standard atmospheric and low pressure CVD processes. The single tube set-up with dual boat logistics is optimized for minimum handling time as well as low cost of ownership with low maintenance costs.
- up to 150 process wafers per batch
- auto alignment
- dual boat logistics
- water cooled heating cassette
- small footprint
- side by side installation possible
Applications
- Annealing
- Diffusion
- LPCVD
- Oxidation
Batch Vacuum Soldering Systems
VLO 180 / VLO 300 vacuum soldering systems
The centrotherm vacuum soldering systems VLO 180 and VLO 300 are designed for high volume production and are equipped with integrated heating and cooling plates, which can be individually controlled. This system is proper for production facilities which run flux less and void less soldering processes with various gas atmospheres. It can also provide wet chemical activation with HCOOH for ultra high quality solder joints.
- use of lead-free or leaded pastes and pre-forms without flux
- process temperature up to 650°C at excellent temperature uniformity
- heating ramp up to 40 K/min
- cooling ramp up to 180 K/min
- vacuum level up to 10-1 mbar
- optional: 100% H2
- small footprint
- low materials consumption thanks to batch technology
Applications
- Packaging
- Sealing
- Soldering
Batch Vacuum Soldering Systems
VLO 20 R&D and small series vacuum soldering system
The VLO 20 vacuum soldering system meets the highest demands of R&D departments as well as the needs of small production facilities which use vacuum to achieve void less soldering joints. This system is ideal for production facilities which run flux less and void less soldering processes with various gas atmospheres and can also provide wet chemical activation with HCOOH and dry chemical activation with MW or RF plasma for high quality solder joints.
- use of lead-free or leaded pastes and pre-forms without flux
- process temperature up to 450°C at excellent temperature uniformity
- heating ramp up to 50 K/min
- cooling ramp up to 180 K/min
- vacuum level up to 10-5 mbar
- small footprint
- low materials consumption thanks to batch technology
Applications
- Packaging
- Sealing
- Soldering
Batch Vacuum Soldering Systems
VLO 6 vacuum soldering system for start-ups, R&D and small series production
The VLO 6 is the small-size entry level system and has been designed to cope with the highest demands of Advanced Packaging and Power Semiconductor applications. The VLO 6 achieves very high heating and cooling rates and is ideal for flux less and void less soldering processes. It provides both wet chemical (HCOOH) and dry chemical (MW plasma) activation for high-quality soldering.
- use of lead-free or leaded pastes and pre-forms without flux
- process temperature up to 400°C at excellent temperature uniformity
- heating ramp up to 250 K/min
- cooling ramp up to 180 K/min
- vacuum level up to 10-5 mbar
- small footprint
- low materials consumption thanks to batch technology
Applications
- Packaging
- Sealing
- Soldering
PRODUCT SEARCH
Next exhibition event
16. - 18.03.2010
SEMICON China
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